منابع مشابه
European Microelectronics and Packaging Symposium
An advanced substrate level patterning technique is presented to realize 3D interconnection circuitry on electronic modules. The technique is based on diffraction of light by phase gratings. The phase gratings are incorporated into the photomask at discrete locations. By illuminating the photomask at normal incidence, the phase grating causes locally inclined UV exposure, which is used to expos...
متن کاملHigh Reliability Plastic Packaging for Microelectronics
This Laboratory Directed Research & Development (LDRD) project conducted in fiscal years 1996 and 1997 under case 3526.030 was devoted to the development of test structures and associated measurement methodology for assessing the reliability of plastic encapsulated microelectronic devices. The end goal was the conceptual specification of one or more Assembly Test Chips (ATCs) which could be use...
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Design automation or computer-aided design (CAD) for microelectronic circuits has emerged since the creation of the integrated circuits (IC). It has played a crucial role to enable the rapid development of hardware and software systems in the past several decades. CAD techniques are the key driving forces behind the reduction of circuit design time and the optimization of the circuit quality. M...
متن کاملDesign Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
Multiple parameters are involved in the design of anisotropic conductive adhesive assemblies, and the overlapping influences that they have on the final electrical contact resistance represent a difficult challenge for the designers. The most important parameters include initial bonding force F, number of particles N, the adhesion strength GA, and modulus of elasticity E of the cured resin. It ...
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The success in consumer electronics in the 1990’s will be focused on low-cost and high performance electronics. Recent advances in polymeric materials (plastics) and integrated circuit (IC) encapsulants have made high-reliability very-large-scale integration (VLSI) plastic packaging a reality. High-performance polymeric materials possess excellent electrical and physical properties for IC prote...
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ژورنال
عنوان ژورنال: Journal of Electronic Packaging
سال: 1989
ISSN: 1043-7398,1528-9044
DOI: 10.1115/1.3226540